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Background
Slicing can create surface defects on silicon wafers. The lapping process grinds the surface silicon from the wafer to remove the defects, resulting in an accurately smooth, extremely flat, unpolished surface. Lapped surfaces can be reduced to one HLB (helium light bands) in flatness with a roughness of 8 Ra or better.
Choosing a diamond wheel for lapping
Diamond wheels with a super fine grit are best suited for lapping.
GAASH diamond grinding wheels for lapping, produce exceptionally fine finishes, run cooler, and extend the wheel life by reducing the number of passes required to remove large material.
Most commonly used GAASH diamond wheels for lapping silicon wafers
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