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Background
Slicing is the term used for cutting a pure, silicon cylinder ingot into very thin wafers by means of a diamond dicing saw. The wafers are then polished to the required smoothness and thickness.
Choosing a diamond wheel for grinding dicing saws
GAASH produce an array of diamond tools uniquely designed to manufacture and restore diamond dicing saws.
GAASH’s line of ultra thin diamond grinding wheels consistently handle precision tolerances, create less defects, and maintain the saw’s reliability.
Most commonly used GAASH diamond wheels for slicing silicon wafers
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