Ceramic grinding

Background
The range of electrical properties found in silicon-based advanced ceramics (see Types of advanced ceramic materials) make them ubiquitous components in the electronics industry. Ceramic grinding is performed after the ceramic component has been sintered, and involves three distinct but inter-related processes:

Slicing

Lapping

Polishing

Types of advanced ceramic materials

1. Silicon carbide (SiC)
   

2. Silicon nitride (Si3N4)
   

3. Tungsten Carbide (WC)
   

4. Zirconium (Zr)
   

5. Aluminum nitrade (AIN)
   

6. Aluminum oxide (AI203)
   

7. Boron carbide (B4C)
   

Advantages of grinding silicon-based advanced ceramics with a diamond grinding wheel

1. Creates accurately smooth surfaces
   

2. Minimizes burring
   

3. Extremely tight tolerances can be achieved
   

4. Unique profiles and geometries can be ground
   

Choosing a diamond wheel for ceramic grinding

GAASH manufacture a complete range of high precision, diamond grinding wheels, specialized for ceramic grinding, slicing, lapping, and polishing. The advanced GAASH wheel design and grit layout, produces extremely flat, highly polished surfaces, with a minimum of surface defects.

Most commonly used GAASH grinding diamond wheels for ceramics

1. 1A1